Taiwan Semiconductor Manufacturing Company (TSMC) introduced its N4X manufacturing process this week, promising revolutionary capabilities in high-performance computing (HPC) designs.
N4X technology
TSMC confirms that the N4X outperforms the N5 by as much as 15%, or 4 percent over the more powerful N4P at 1.2 V. The N4X can produce drive voltages greater than 1.2 millivolts and deliver higher performance. Customers can apply the identical design principles to N5 to speed up N5 process development and speed up production of N4X products. In keeping with TSMC, N4X is scheduled to begin dangerous production within the second quarter of 2023.
N4X features include:
* Backend metal stack optimization for prime performance projects
Design and construction to fulfill maximum drive current and frequency requirements.
*metal-insulator-metal capacitors with very high density ensuring reliable power supply under demanding loads
With extensive advanced 3DFabricTM packaging technologies and the TSMC Open Innovation Platform(r), TSMC’s HPC platform not only provides performance-optimized silicon with N4X technology, but additionally a broad platform to enable design with our ecosystem partners.
What can TSMC expect from HPC?
These are high performance computing (HPC) products which can be well-known for his or her advantages:
* Improves big data processing with FPGA base
* Denies additional SRAM to SoC
* Ease of programming because of the use of varied architectures
* Maximum design technology that enables for optimum flexibility
* Obtains greater utilization and greater dynamic power
* Greater memory bandwidth combined with faster I/O connectivity
(TMSC Process Roadmap for Technology)
TSMC predicts that HPC will take over the smartphone industry because the most important driver of its growth in the following few years.
Senior vp of business development at TSMC, Kevin Zhang, said that the HPC product line is the fastest growing market segment for the corporate and that the launch of N4X is an honor for them because it is the primary time that fusion technology has had place for the “X” line of high-performance semi-technology.
N4X is coping with increased compute demand as HPC devices approach their maximum grid size, in line with Yujun Li, director of HPC business development at TSMC.
In keeping with the report, the event of HPC-enabled processing technologies is anticipated to happen by 2022.
A serious Apple supplier recently received approval from Taiwan’s Ministry of Economic Affairs Investment Commission to establish an Apple wafer production plant in Japan that may partner with SONY.
Should you find an error within the text, please send a message to the creator by choosing the error and pressing Ctrl-Enter.